Technical characteristics

Design according

PICMG AMC.0
(RoHS compliance)

 

 

Number of contacts

170

Contact spacing

0.75 mm

Clearance and creepage
distance between
contacts

 

0.1 mm min.

 

 

Working current

1.52 A @ 70 °C

power contact as defined in AMC.0 spec.

max. 30 °C temp. rise

Test voltage

80 Vr.m.s.

Initial contact resistance

 

ground contact

60 mΩ max.

signal, power, general

 

purpose contacts

90 mΩ max.

Initial insulation resistance

10 MΩ

 

 

Nominal differential
impedance

 
100 Ω ± 10 %

Max. crosstalk @ 25 ps risetime

Bottom route

Adjacent

0.55 %

Basic-to-extended (diagonal)

0.68 %

Basic-to-extended (opposite)

0.39 %

Multiline (five multi-aggressor differential pairs)

 
2.74 % max.

 

 

 

Differential propagation
delay

Basic side:

125 ps

Extended side:

145 ps

Differential skew

Between basic and
extended side:

 
20 ps

Within basic and
extended side:

 
+
2 ps

 

 

Temperature range

-55°C ... +125 °C

Durability as per
AMC.0 specification

 
200 mating cycles in total

 

 

Termination technique

Press-in termination

Mating force

100 N max.

Withdrawal force

65 N max.

 

 

Materials

 

Mouldings

Liquid Crystal Polymer
(LCP), UL 94-V0

Contacts

Copper Alloy

Contact surface

Palladium nickel plated

 

 

Packaging

Card box (other packaging on request)

 

Recommended plated through hole specification

Tin plated PCB (HAL)

Hole Ø

0.64±0.01 mm

Cu

25 – 35 μm

Sn

5 – 15 μm

Plated hole Ø

0.53 – 0.60 mm

Au / Ni plated PCB

Hole Ø

0.64±0.01 mm

Cu

25 – 35 μm

Ni

3 – 7 μm

Au

0.05 – 0.12 μm

Plated hole Ø

0.55 – 0.60 mm

Chemical tin plated PCB

Hole Ø

0.64±0.01 mm

Cu

25 – 35 μm

Sn

0.8 – 1.5 μm

Plated hole Ø

0.56 – 0.60 mm

Silver plated PCB

Hole Ø

0.64±0.01 mm

Cu

25 – 35 μm

Ag

0.1 – 0.3 μm

Plated hole Ø

0.56 – 0.60 mm

OSP copper plated PCB

Hole Ø

0.64±0.01 mm

Cu

25 – 35 μm

Plated hole Ø

0.56 – 0.60 mm

The press-in zone of the AdvancedMC ™ connector is tested according to Telcordia/Bellcore GR 1217CORE Part7. It is approved to be used with a plated through hole according IEC 60352-5 with a diameter of 0.55±0.05 mm (drilled hole 0.64±0.01 mm).

Based on our experiences regarding the production process of the PCB manufacturer we recommend a plated through hole configuration like shown in the above spreadsheet. To achieve the recommended plated through hole diameter, it is important to specify especially the drilled hole diameter of 0.64±0.01 mm to your PCB supplier.

For drillings use e.g. drill bit # 72 (0.025" ≈ 0.64 mm).