Technical characteristics
|
Design according |
PICMG 3.0 R2.0 |
|
|
|
|
Total number of contacts |
30, max. 34 |
|
Power contact |
8 |
|
Signal contact |
22, max. 26 |
|
|
|
|
Clearance and creepage
distance between
contacts |
|
|
Within group 5-16 |
0.7 mm min. |
|
Within group 17-24 |
2.5 mm
min. |
|
25 to 26 |
5.5 mm min. |
|
Within group 27-34 |
1.4 mm min. |
|
13-16 to 17-20 |
3.0 mm min. |
|
21-24 to 25-26 |
4.0 mm min. |
|
25-26 to 27-29 |
2.0 mm min. |
|
|
|
|
Sequential contact engagement |
|
|
1st |
25, 26, 28, 29, 30, 31 |
|
2nd |
33 |
|
3rd |
5-24, 34 |
|
4th |
27, 32 |
|
|
|
|
Working current |
|
|
Power contact |
16 A |
|
Signal contact |
1 A |
|
|
|
|
Test voltage |
|
|
Contact 1-16 |
1000 Vr.m.s. |
|
Contact 17-34 |
2000 Vr.m.s. |
|
|
|
|
Initial contact resistance |
|
|
Power contacts |
<
2.2 mΩ |
|
Signal contacts |
<
8.5 mΩ |
|
|
|
|
Insulation resistance |
>
108 Ω |
|
|
|
|
Temperature range |
-55°C ... +125 °C |
|
Durability |
250 mating cycles |
|
|
|
|
Termination technique |
Press-in termination |
|
Mating force |
67 N max. |
|
Withdrawal force |
67 N max. |
|
|
|
|
Derating for ATCA® power contacts
Contact loading acc. PICMG 3.0 |
|
|
|
(1) Derating
(2) Derating @ Imax. x 0.8
(acc.
IEC 60 512-5-2) |
|
|
|
|
Materials |
|
|
Moulded parts |
PBT, glass-fibre filled,
UL 94-V0 |
|
Contacts |
Copper Alloy |
|
Contact surface |
Selectively gold plated |
|
|
|
|
Packaging |
Tray packaging (other packaging on request) |
Recommended plated through hole specification
|
|
|
Signal contacts |
Power contacts |
|
Tin plated PCB (HAL) |
Hole Ø |
1.15±0.025 mm |
1.75±0.025 mm |
|
Cu |
25 – 35 μm |
25 – 35 μm |
|
Sn |
5 – 15 μm |
5 – 15 μm |
|
Plated hole Ø |
1.00 – 1.10 mm |
1.60 – 1.70 mm |
|
Au / Ni plated PCB |
Hole Ø 0.64 |
1.15±0.025 mm |
1.75±0.025 mm |
|
Cu |
25 – 35 μm |
25 – 35 μm |
|
Ni |
3 – 7 μm |
3 – 7 μm |
|
Au |
0.05 – 0.12 μm |
0.05 – 0.12 μm |
|
Plated hole Ø |
1.00 – 1.10 mm |
1.60 – 1.70 mm |
|
Chemical tin plated PCB |
Hole Ø |
1.15±0.025 mm |
1.75±0.025 mm |
|
Cu |
25 – 35 μm |
25 – 35 μm |
|
Sn |
0.8 – 1.5 μm |
0.8 – 1.5 μm |
|
Plated hole Ø |
1.00 – 1.10 mm |
1.60 – 1.70 mm |
|
Silver plated PCB |
Hole Ø |
1.15±0.025 mm |
1.75±0.025 mm |
|
Cu |
25 – 35 μm |
25 – 35 μm |
|
Ag |
0.1 – 0.3 μm |
0.1 – 0.3 μm |
|
Plated hole Ø |
1.00 – 1.10 mm |
1.60 – 1.70 mm |
|
OSP copper plated PCB |
Hole Ø |
1.15±0.025 mm |
1.75±0.025 mm |
|
Cu |
25 – 35 μm |
25 – 35 μm |
|
Plated hole Ø |
1.00 – 1.10 mm |
1.60 – 1.70 mm |
The press-in zone of the AdvancedTCA® power connector is tested according
to Telcordia/Bellcore GR 1217CORE Part7. It is approved to be used with
a plated through hole according IEC 60352-5 with a diameter of 1.00 +
0.09 – 0.06 mm for signal contacts and 1.60 + 0.09 – 0.06 mm for power
contacts (drilled hole 1.15±0.025 mm resp. 1.75±0.025 mm).
Based on our experiences regarding the production process of the PCB
manufacturer we recommend a plated through hole configuration like shown
in the above spreadsheet. To achieve the recommended plated through hole
diameter, it is important to specify especially the drilled hole diameter
of 1.15±0.025 mm resp. 1.75±0.025 mm to your PCB supplier.
