Technical characteristics

Design according	PICMG MTCA.0 R1.0 (RoHS compliance)

Total number of contacts	96
Power contact	24
Signal contact	72

Sequential contact engagement
1st	Power 4-11
2nd	Power 1-3, power 12-24
3rd	Signal A2-H9
4th	Signal A1

Working current
Power contact	9.3 A @ 80 % derating acc. IEC 60 512 and 70 °C ambient temperature and 30 °C temperature rise
Signal contact	1 A @ 80 % derating acc. IEC 60 512 and 70 °C ambient temperature

Initial contact resistance
Power contacts	< 5 mΩ
Signal contacts	< 25 mΩ

Initial insulation resistance	> 100 MΩ

Temperature range	-55°C ... +105 °C
Durability	200 mating cycles

Termination technique	Press-in termination
Mating force	145 N max.
Withdrawal force	110 N max.

Derating for MicroTCA™ power contacts Contact loading acc. MTCA.0

(1) Derating (2) Derating @ Imax. x 0.8 (acc. IEC 60 512-5-2)

Materials
Moulded parts	PBT, glass-fibre filled, UL 94-V0
Contacts	Copper Alloy
Contact surface
Power contacts:	selectively gold plated
Signal contacts:	selectively palladium nickel plated

Packaging	Tray packaging (other packaging on request)

Recommended plated through hole specification

Tin plated PCB (HAL)	Hole Ø	0.7±0.02 mm
	Cu	25 – 35 μm
	Sn	5 – 15 μm
	Plated hole Ø	0.60 – 0.65 mm
Au / Ni plated PCB	Hole Ø	0.7±0.02 mm
	Cu	25 – 35 μm
	Ni	3 – 7 μm
	Au	0.05 – 0.12 μm
	Plated hole Ø	0.60 – 0.65 mm
Chemical tin plated PCB	Hole Ø	0.7±0.02 mm
	Cu	25 – 35 μm
	Sn	0.8 – 1.5 μm
	Plated hole Ø	0.60 – 0.65 mm
Silver plated PCB	Hole Ø	0.7±0.02 mm
	Cu	25 – 35 μm
	Ag	0.1 – 0.3 μm
	Plated hole Ø	0.60 – 0.65 mm
OSP copper plated PCB	Hole Ø	0.7±0.02 mm
	Cu	25 – 35 μm
	Plated hole Ø	0.60 – 0.65 mm
PCB board thickness: > 1.4 mm

The press-in zone of the :icroTCA ™ power connector is tested according to Telcordia/Bellcore GR 1217CORE Part7. It is approved to be used with a plated through hole according IEC 60352-5 with a diameter of 0.55±0.05 mm (drilled hole 0.64±0.01 mm).

Based on our experiences regarding the production process of the PCB manufacturer we recommend a plated through hole configuration like shown in the above spreadsheet. To achieve the recommended plated through hole diameter, it is important to specify especially the drilled hole diameter of 0.7±0.02 mm to your PCB supplier.